Component Traceability

The 2-19a Critical Components Traceability Task Group held its first face-to-face meeting to continue development of the working draft IPC-1782, Standard for Traceability of Critical Items Based on Risk. This standard will establish minimum requirements for traceability of items throughout the entire supply chain, with particular initial emphasis on component traceability through the manufacturing and assembly processes. This standard will also be used as a base document for a possible series of standards for traceability of other parts through the supply chain.

Base Materials

The 3-11 Laminate/Prepreg Materials Subcommittee successfully examined and modified Amendment 2 to the IPC-4101D-WAM1, Specification for Base Materials for Rigid and Multilayer Printed Boards. Amendment 2 is proposed by the European Space Agency to concentrate on laminate and prepreg of substantially lower contaminant level.  The proposed Amendment 2 will be composed of a newly constructed Appendix A which will be routed as a Final Draft for comment to all interested parties.

The 3-11f UL/CSA Task Group reviewed the 22 items for STP Ballot in UL 746E.  This Ballot will close on November 9, 2015.

The 3-11g Corrosion of Metal Finishes Task Group discussed work that IBM (Dr. P. J. Singh) has done with Flowers of Sulfur testing.

The 3-12a Metallic Foil Task Group addressed the non-contact surface roughness test (proposed TM 2.2.22).  Re-analysis of the round robin test data showed that the Gauge R & R was sufficient such that the proposed test method would be sent out as a Final draft for comment, once the test method verbiage was ‘cleaned up’.

The 3-12d Woven Glass Reinforcement Task Group reviewed spread glass data generated by JPS using weave style 1280 E-glass.  Three new weave styles were submitted for addition into the IPC-4412B Appendices II. – These will be routed as a Final Draft of an Amendment 2.  Finally, a minor change was noted to the group as to an IPC position statement concerning a European REACH treatment of boron trioxide as a Substance of Very High Concern.

Fabrication Processes

The 4-14 Plating Processes Subcommittee reviewed the latest draft of IPC-4552A, Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards.  The group also reviewed the about-to-be released Amendment 1 to IPC-4556, Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards.

Assembly and Joining

The 5-11c Electronic Assembly Adhesives Task Group recently approved for publication IPC-HDBK-4691, Handbook on Adhesive Bonding of Electronic Assembly Operations. The group will celebrate the publication when it meets at APEX/EXPO in Las Vegas. The task group will also begin review of orphaned Test Method 2.4.51 for dispersion of glass microbeads in self-shimming thermally conductive adhesives. The group will investigate if a similar industry test exists and also if glass microbeads in adhesives are still used on a regular basis.

The 5-20 Product Assurance Committee reviewed the status of the projects in its scope and started planning for the meetings to be held at APEX 2016.

The 5-21f Ball Grid Array Task Group has begun work on the D revision of IPC-7095, Design and Assembly Process Implementation for BGAs. Items to be addressed in this revision include harmonization with the latest revisions of IPC-A-610 and J-STD-001, updating the Reliability section, supply chain issues and oxidation levels of ball surfaces.

The 5-21g Flip Chip Mounting Task Group continued its work on revision A to IPC-7094, Design and Assembly Process Implementation for Flip Chip and Die Size Components. The group is focusing on glob top, dam and fill, and frame and fill adhesives as well as reviewing submitted content and existing/new figures for the standard.

The 5-21h Bottom Termination Components Task Group broke ground on the A revision of IPC-7093, Design and Assembly Process Implementation for Bottom Termination SMT Components and is seeing strong interest and support in upgrading the standard. Topics under consideration include consistency of product from multiple suppliers, addressing components 1 mm to 4 mm and inspecting microcracking and poor adhesion.

The 5-22a J-STD-001 Task Group reviewed comments on IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies. This task group met a second day to resolve comments on criteria common to both IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610, Acceptability for Electronic Assemblies. The group also celebrated completion of the forthcoming J-STD-001 Revision F Amendment 1.

The 5-22ad Requirements for Military Systems Work Group met to discuss content to an addendum to J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies, that addresses hardware contracted by the U.S. Department of Defense and used in military systems.

The 5-22arr J-STD-001/Conformal Coating Material & Application Industry Assessment Task Group discussed the current status of round robin testing.

The 5-22as Task Group met to discuss an addendum to 5-22as, Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical and Electronic Assemblies.

The 5-22f IPC-HDBK-001 Task Group celebrated the completion of the forthcoming revision to IPC-HDBK-001, Handbook and Guide to Supplement J-STD-001, and discussed opening the document for an amendment to address changes as a result of J-STD-001F, Am 1.

The 5-23a Printed Circuit Board Solderability Specifications Task Group reviewed all comments submitted on the Amendment 1 to the J-STD-002D, including the substantial number from Jim Daggett of Raytheon.

The 5-23b Component and Wire Solderability Specification Task Group reviewed some potential changes to J-STD-003C that may just allow the people from DSCC to accept what could be the revision D of this standard.

The 5-24a Flux Specifications Task Group reviewed the SIR test method verification plan, including comparing the current J-STD-004 plan with the IEC round robin plan to determine the test board preparation procedures, specify the testing protocol and set the timing for the testing.

The 5-24b Solder Paste Task Group reviewed testing of solder balls, paste wetting and tackiness (tack) plus discussed rheometry testing using both parallel plate and spiral pump viscometers.

The 5-24c Solder Alloy Task Group discussed the addition of one more patented  lead free alloy to J-STD-006; the best way to address the addition of rare earth elements to lead free alloys and then discussed three IPC TM-650 test methods that will be placed in the 5-24c TG KAVI site for additional discussion by members of the task group.